Quality and authenticity are more critical than ever in the fast-paced world of electronic components. Counterfeit parts, hidden defects, and material inconsistencies can lead to failures that compromise entire supply chains. At Rand Technology, we take a proactive approach to quality control by utilizing state-of-the-art in-house tools to verify the integrity of every component we handle.
According to an annual report from ERAI—which offers its members supply chain risk mitigation solutions, including Rand—1,055 suspected counterfeit and nonconforming parts were identified. The number of counterfeit parts found was a 25% increase over the previous year, and the number of parts reported by ERAI has increased by the highest since 2015.
The Rand Certified standard ensures that each part we receive undergoes elevated inspection to address counterfeit risk and provide traceability. We equip our in-house facilities with cutting-edge technology to detect defects, verify material compositions, and ensure compliance with industry standards. Here’s how each tool plays a crucial role in our quality assurance process:
X-Ray Imaging
X-ray imaging allows us to inspect internal structures without damaging the components. Engineers use it to verify DIE placement, bond wires, and the internal structure for consistency while also identifying potential defects and inconsistencies. The imaging ensures that every part’s internal design matches the original specifications, helping us detect unauthorized modifications, voids, or soldering issues that could compromise performance.
C-SAM (Scanning Acoustic Microscopy)
C-SAM is particularly useful for high-reliability components where internal defects, such as delaminations or voids, are not visible to the naked eye. It also allows us to detect internal degradation of the parts due to age or poor manufacturing. This non-destructive testing method ensures that each component meets rigorous quality standards before reaching the customer.
Solderability Testing
Reliable solder joints are essential for product durability. Our solderability testing evaluates whether components will form strong, lasting connections, ensuring they perform optimally in real-world applications. Technicians perform the testing by verifying that the component’s terminations will solder to the board without issues, ensuring the terminations haven’t been compromised by oxidation or tarnish due to age.
XRF (X-ray Fluorescence)
Material verification is key to preventing failures caused by incorrect alloy compositions. XRF analysis allows us to confirm the elemental composition of materials and finishes, ensuring compliance with industry regulations and specifications. We confirm that the components’ termination plating matches the datasheet specifications and complies with the RoHS directive.
Decapsulation
Decapsulation involves carefully removing the outer layers of a component to expose its internal die. Verifying that the die markings match those of the manufacturer helps confirm authenticity, detect counterfeits, and compare the internal structure against known standards.
Keyence High-Power Microscope
For a closer look at surface markings, part anomalies, and potential counterfeits, we use the Keyence high-power microscope. This tool provides high-resolution imaging that helps us inspect intricate details and ensure the authenticity of every component.
By leveraging these tools, Rand Technology upholds its commitment to delivering only the highest quality components to our customers. Our in-house testing capabilities not only mitigate risks but also enhance supply chain security, ensuring that our partners receive genuine, fully functional parts that meet industry standards.
Quality control isn’t just a step in our process—it’s the foundation of everything we do. Through innovation, precision, and expertise, Rand Technology goes beyond industry standards to lead the way in ensuring the integrity of electronic components worldwide.
Learn more about Rand Technology’s certifications and testing on our quality page.
